| 摘要 |
PROBLEM TO BE SOLVED: To provide a SAW device capable of being miniaturized, made light in weight and thinned and obtaining electric characteristics equal to the SAW device by a conventional wire connection method. SOLUTION: This surface acoustic wave device S1 is composed by mounting a surface acoustic wave element 1 on a base body 5 where plural conductor patterns 6 and 7 for grounding and the plural conductor patterns 4 for signals are formed. The conductor patterns 4 for the signals are disposed between the two conductor patterns 6 and 7 for grounding at a prescribed distance and the two conductor patterns 6 and 7 for grounding are connected by an inductor 9.
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