| 摘要 |
PROBLEM TO BE SOLVED: To reduce the total height of a device and increase a heat transfer coefficient in order that a stacked heat sink and generated pressure loss also may surely operate in parallel regarding a flow, in a device for cooling a diode laser. SOLUTION: Channels arranged on a stacked faces are divided into groups every face which are fluid-connected in series. In order to be connected in series, a fluid connection link common to the stacked faces is opened. As a heat sink of a diode laser, this device is suitable for cooling, in particular, diode laser arrays and the stack of them.
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