| 摘要 |
PURPOSE:To improve the insulation property of a contact member capable of desorption with semiconductors by making the, contact member out of a core material consisting of a metallic material and a pack where an insulating film is provided on the outside of this core material. CONSTITUTION:A contact member 1 is arranged between a heat sink 8 and an LSI chip 7. For the contact member 1, liquid such as grease is charged in an insulating pack 2 to improve heat conductivity. It is put in such a structure that it can absorbs the displacement of the height of the LSI chip 7 by changing the thickness of the contact member 1. Especially, the pack material of the container-shaped pack 2, which forms a contact shoe, is put in multilayer structure, and a thin metallic material is provided for the core material 40, and insulating films are provided on both sides of the core material 40. Moreover, the pack material of the containershaped pack 2 is made a metallic foil, and an insulating resin foil is stacked on both sides or single side of it. Hereby, the insulation property of the contact member 1 capable of desorption with the heat sink 8 and the semiconductor parts represented by the LSI chip 7 can be improved. |
