| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding roller for a semiconductor wafer and a method for grinding the semiconductor wafer using the same, with which a grinding rate can be improved and a damage to the wafer during grinding be also reduced. SOLUTION: Grinding rollers 10A and 10B are rotated, while supplying a slurry containing grinding abrasive grains, so s to allow the rollers 10A and 10B to be brought into contact with the front and rear surfaces and chamfering surface of a silicon wafer W for grinding. The rollers 10A and 10B are larger in hardness and higher in grinding speed than those of the conventional grinding cloths. Therefore, the grinding rate is made higher. Furthermore, in the rollers 10A and 10B, grinding abrasive grains of 1 μm or smaller in particle size are fixed on the grinding working surface of the roller body made of synthetic resin. As a result, the silicon wafer W can be ground in a high accuracy with fine grinding abrasive grains, thereby reducing working damages to the wafer W. |
