| 摘要 |
PROBLEM TO BE SOLVED: To provide a bidirectioal optical module which can be miniaturized, is superior in productivity and inspectional property and further can cope with the future development of high frequency. SOLUTION: In the bidirectional optical module M, consisting of a passive optical circuit such as a transmitting surface-emitting element 5, a receiving light-receiving element 6 and a branching element, the transmitting surface- emitting element 5 and the receiving light-receiving element 6 are mounted on the same chip carrier substrate 7 which is worked with high precision, the chip carrier substrate 7 is mounted on and fixed to the recessed part and/or the projected part of the substrate in which the passive optical circuit is formed, and whereby an optical semiconductor element is combined to the passive optical circuit without aligning. |
