| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide electronic parts with high reliability which can allow high-density packaging, and whose bonding strength is high. SOLUTION: Screens 4, 4 wherein a terminal electrode of a passive part element pattern 2 is folded on the surface of a first insulating layer 3 via the insulating layer 3 are formed, and bump electrodes 6, 6 whose forming positions are restricted by a second insulating layer 5 are provided on the screens 4, 4.</p> |
