THERMALLY CONDUCTIVE ELECTRONIC DEVICE CASE

摘要

A case (200) for dissipating heat from an electronic device (220) is provided. The case (200) includes an electronic circuit board (204) with a heat generating electronic component (202) installed thereon. A shield (206) is positioned over the electronic component (202) to protect it from electromagnetic interference. The shield (206) includes an aperture through its top surface. A heat transfer conduit (212) is molded into and through the aperture to contact the top surface of the heat generating electronic component (202). Outer housing (220), which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit (212) which extends outside the shield (206). As a result, heat is dissipated from the electronic component (202) and through the housing of the electronic device (220) via the heat transfer conduit (212) while shielding the electronic component (202) from electromagnetic interference.