发明名称 Soldering of thin plate pack
摘要 <p>A model or pattern of complicated form made up of many thin plates which must be maintained in alignment, has the plates soldered together by coating the plates with e.g. colophonium, assembling them between a pair of plates on locating and securing fixings attached to the plates, leaving sufficient space for entry of solder between them. The assembly is lowered into a preheating bath of glycerine at a temp. 15 degrees C below the m.pt. of the solder, then transferred to a solder bath in which the molten solder is covered with a layer of glycerine deep enough to cover the plates. The plates are tinned by capillary action and the assembly is removed to cooler glycerine baths followed by air cooling.</p>
申请公布号 DE2014177(A1) 申请公布日期 1971.10.14
申请号 DE19702014177 申请日期 1970.03.24
申请人 SIEMENS AG 发明人
分类号 B23K1/08;(IPC1-7):23G1/08 主分类号 B23K1/08
代理机构 代理人
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