Anisotropic stress buffer and semiconductor device using the same

摘要

An anisotropic stress buffer includes a plate or sheet-like body having relatively low elastic modulus. A plurality of elements, each having relatively high elastic modulus, are contained in the plate or sheet-like body, in such a manner that the buffer has a characteristic as a high elastic modulus member having a Young's modulus higher than a predetermined value with respect to a compression stress in the thickness direction and also has a characteristic as a low elastic modulus member having a Young's modulus lower than the predetermined value with respect to a tension stress in the planar direction. A semiconductor device includes such a anisotropic stress buffer to which a semiconductor chip is adhered. Electrode terminals of the chip are electrically connected to a wiring pattern formed on the anisotropic stress buffer.