| 摘要 |
<p>A member having a metallic layer which exhibits an enhanced adhesion between a resin base and a precipitated metal because of chemical interaction without roughening the surface of the resin base, a method for manufacturing the same, a build-up multilayer wiring board using the member, a flexible wiring board, and a wiring board for multi-chip modules all those board being excellent and using the member are disclosed. The member is characterized by comprising a resin base of a resin composition containing an aromatic amide site in its chemical structure, a metallic fine particle layer formed on the resin base, a metal oxide layer formed on the metallic fine particle layer, and a metallic layer formed on the metal oxide layer. The metallic fine particle layer is a catalysis layer, an electroless plating layer is formed on the metallic fine particle layer, and the metallic layer, which is an electroplating layer, is formed on the electroless plating layer, and thus the wiring is set up. By the formation of fine wiring, a build-up multilayer wiring board, a flexible wiring board, and a wiring board for multi-chip modules all excellent in reliability are provided.</p> |
