发明名称 Buried shallow trench isolation and method for forming the same
摘要 An integrated semiconductor device includes a substrate having a buried shallow trench isolation structure and an epitaxial layer disposed over the substrate and the buried shallow trench isolation structure. The epitaxial layer includes a shallow trench isolation structure that extends over the buried shallow trench isolation structure in the substrate to substantially reduce leakage current in the substrate to prevent device latch-up.
申请公布号 US2001002059(A1) 申请公布日期 2001.05.31
申请号 US20010754145 申请日期 2001.01.05
申请人 WINBOND ELECTRONICS CORPORATION 发明人 WONG SHYH-CHYI;LIN SHI-TRON
分类号 H01L21/336;H01L21/762;H01L21/8238;(IPC1-7):H01L29/00 主分类号 H01L21/336
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