| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the position regulation of a lead for connecting a solder ball, etc. to be set on a substrate without positioning a release film on the gate of a resin passage and to set the viscosity of a molten resin high. SOLUTION: A resin molding surface 25 connected with the inner surface of a resin housing cavity 14 formed in the resin molding part 5 of one mold 3 is covered with a release film 26, the resin molding surface 9 of the resin molding part 4 of the other mold 2 is covered with a release film 24, a chip 18 is arranged on the depth side, and the substrate 19 is arranged on the inlet side in the cavity 14 covered with the release film 26 during molding. The resin is housed, the film is placed between the substrate 19 and the resin passage 10, and the gate 12 of the resin passage 10 is formed in the neighbourhood of the inlet of a resin injection hole 17.
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