| 摘要 |
A method for processing semiconductor wafer blanks comprises an enclosed chamber with upper and lower plates with a plurality of fluid openings leading from a source of chemical cleaning fluids, flushing fluid and dry nitrogen gas. The top plate also acts as a vacuum chuck to hold the wafer after the top surface has been cleaned and may rotate or oscillate to enhance the cleaning of the lower wafer surface. The method includes a chemical cleaning of the wafer top followed by processing the lower surface by pumping appropriate chemicals through the lower plate center toward the wafer periphery while the wafer is extremely close to the surface so that the outward moving fluids cover the wafer surface and are sparingly used. As the chemicals flow toward the periphery, their strength is renewed by the addition of new chemicals pumped through additional holes.
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