| 摘要 |
PROBLEM TO BE SOLVED: To improve yield by reducing adhesion of foreign matters to an external terminal of a semiconductor device, and simplify visual inspection after molding. SOLUTION: This semiconductor device comprises a die bonding portion in which a semiconductor chip is mounted on a plurality of tape substrates, first and second wire bonding portions that connect a pad of the semiconductor chip and a substrate side electrode of the tape substrate which corresponds to this pad, a tape reverse portion that arranges the semiconductor chip at the lower side of the tape substrate by reversing a wire-bonded base substrate 2, and a mold portion in which a cavity 4e and a positioning pin 4f that positions the base plate after the front and rear are reversed are provided at a die surface 4d of a lower die 4c. In the mold portion, the misalignment of a sealing portion can be prevented by guiding the base plate 2 after the front and rear are reversed with the positioning pin 4f, arranging the semiconductor chip at the cavity 4e, and subsequently performing molding. |
