| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate for a camera which corresponds with both QFP mounting and bare chip assembling and has a superior flexibility in production. SOLUTION: This invention is related to a substrate for a camera having circuit patterns on both surfaces, which has a first junction terminal group 301 for junctioning an IC package on a surface, a second junction terminal group 310 for junctioning bare ships on another surface and junctioning lines which junction each terminal of the first junction terminal group 301 with each corresponding terminal to the second junction terminal group 302.</p> |
