发明名称 ETCHING SOLUTION FOR NICKEL OR NICKEL ALLOY
摘要 PROBLEM TO BE SOLVED: To produce an etching solution for nickel or a nickel alloy in which the etching rate of the nickel or a nickel alloy is high, also, the erosion of the other metals such as copper and a copper alloy in particular is extremely small, and moreover, side etching is hardly occurred. SOLUTION: In an etching solution in which, from the material in which nickel or a nickel alloy and the other metals are coexistent, the nickel or nickel alloy is selectively etched, this etching solution for nickel or a nickel alloy is composed of an aqueous solution containing (A) nitric acid of 5 to 5 weight %, (B) sulfuric acid of 0.5 to 40 weight %, (C) the main oxidizer selected from peroxide, nitrate and an aromatic nitro compound of 0.1 to 20 weight % and (D) chlorine ions of 0.0001 to 0.5 weight %.
申请公布号 JP2001140084(A) 申请公布日期 2001.05.22
申请号 JP20000122946 申请日期 2000.04.24
申请人 MEC KK 发明人 YONEOKA TAKESHI;AKIYAMA DAISAKU
分类号 C23F1/28;C23F1/44;H01L21/306;H05K3/06;(IPC1-7):C23F1/28 主分类号 C23F1/28
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