发明名称 Method for separating solder and solder oxides
摘要 A soldering apparatus includes a solder wave shape forming means for melting solder and forming a solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.
申请公布号 US6235208(B1) 申请公布日期 2001.05.22
申请号 US20000680953 申请日期 2000.10.10
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KAWASHIMA YASUJI;SHIMIZU KAORU
分类号 B23K1/018;B23K1/08;B23K1/20;B23K3/08;C22B25/06;C22B25/08;H05K3/34;(IPC1-7):B01D17/00 主分类号 B23K1/018
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