发明名称 GRINDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a grinding apparatus which is high in accuracy and efficient in operation without generating any surface burn or breakage of a workpiece or damaging the apparatus itself. SOLUTION: The workpiece W held by a chuck table 5 is positioned to a grinding means 7 of the grinding apparatus, and ground by a grinding part 8 while adjusting the feed speed of a spindle unit 12 by a spindle feed means 13. The grinding resistance generated by the grinding pressure during the grinding operation is detected by Kisler dynamometers A, B and C of an abrasive resistance detecting means 14, and the detected signal is inputted in a judging means 15 to judge whether or not the detected signal is within a predetermined threshold. When it is judged to be within the threshold, the command signal for maintaining the speed is inputted from a speed control device 16 into a CPU of the grinding apparatus to maintain the feed speed of the spindle unit 12 to be invariable. When it is judged that the detected signal exceeds the threshold, the feed speed of the spindle unit 12 is appropriately adjusted by the command for acceleration or deceleration.
申请公布号 JP2001138219(A) 申请公布日期 2001.05.22
申请号 JP19990329913 申请日期 1999.11.19
申请人 DISCO ABRASIVE SYST LTD 发明人 KOMA YUTAKA
分类号 B24B37/00;H01L21/304 主分类号 B24B37/00
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