发明名称 HIGH-FREQUENCY-WELDABLE RESIN, AND HIGH-FREQUENCY- WELDABLE FILM AND ITS PRODUCTION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a high-frequency-weldable resin which sufficiently generates heat under a high frequency and, when formed into a layer on the surfaces of substrates, enables various members or materials to be bonded to each other by a high frequency and to provide a method for producing a high-frequency- weldable film which is prepared by using the resin and is well bondable by a high frequency to polyolefin substrates. SOLUTION: This high-frequency-weldable resin is a copolymer prepared by copolymerizing (a) a polymerizable monomer having a tertiary carbon structure and a double bond, (b) at least one other radical-polymerizable monomer, and preferably (d) an olefin homopolymer or copolymer having molecular terminals modified with radical-polymerizable double bonds. The method for producing a high-frequency-weldable film comprises coextruding the above high-frequency-weldable resin together with an olefin resin into an integral film laminate.</p>
申请公布号 JP2001139636(A) 申请公布日期 2001.05.22
申请号 JP19990327188 申请日期 1999.11.17
申请人 SEKISUI CHEM CO LTD 发明人 TOGAWA KATSUYA;KURODA TAKEO
分类号 B32B27/30;B29C47/06;B29C65/04;B32B27/32;C08F220/12;(IPC1-7):C08F220/12 主分类号 B32B27/30
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