| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer transfer apparatus which simplifies wafer transfer processing to reduce the time and improves operational efficiency. SOLUTION: Wafers are housed in slide grooves 15c, 16c of first carrier cassettes 15, 16, the cassettes are mounted on a first carrier cassette mount plate 6 on a turntable 5, and a second carrier cassette 17 is mounted on second carrier cassette mounting plates 9a, 9b. A pusher 12 is moved in the arrow mark direction X to move the wafers through a first and second push plates 13a, 13b from the first carrier cassettes 15, 16 to the second carrier cassette 17. When processing ends with prescribed steps, the turntable is rotated by 180 deg., from the position shown, to transfer the wafers from the second carrier cassette 17 to the first carrier cassettes 15, 16.
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