摘要 |
PROBLEM TO BE SOLVED: To provide a light wafer prober for efficiently and quickly heating and cooling a wafer prober, and for controlling the temperature, and for preventing generation of bending even at the time of pressing a probe card, and for validly preventing the damages to a silicon wafer or measurement error. SOLUTION: This wave prober device is constituted of a ceramic substrate on whose surface a conductive layer is formed, and at which a heating means is arranged and a support container, and the support container are provided with a fluid blowout port.
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