发明名称 WAFER PROBER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a light wafer prober for efficiently and quickly heating and cooling a wafer prober, and for controlling the temperature, and for preventing generation of bending even at the time of pressing a probe card, and for validly preventing the damages to a silicon wafer or measurement error. SOLUTION: This wave prober device is constituted of a ceramic substrate on whose surface a conductive layer is formed, and at which a heating means is arranged and a support container, and the support container are provided with a fluid blowout port.
申请公布号 JP2001135684(A) 申请公布日期 2001.05.18
申请号 JP20000251111 申请日期 2000.08.22
申请人 IBIDEN CO LTD 发明人 ITO ATSUSHI;HIRAMATSU YASUJI;ITO YASUTAKA
分类号 G01R31/26;G01R1/06;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/26
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