发明名称 WIRE BONDING APPARATUS AND ITS USING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wire bonding apparatus which can facilitate positioning a plane electrode to a bonding wire when the plane electrode is exchanged, and a using method of the apparatus. SOLUTION: This bonding apparatus is equipped with a plane electrode part 44 which fuses a tip of a fusible wire W for bonding by applying a current via a gap to the tip of the wire W inserted into a capillary 20 and forms a fused ball B, and an electrode fixing arm 41 which fixes and supports the plane electrode 44. The plane electrode 44 has an insertion shaft 44a in the rear end. The electrode fixing arm 41 has a fixing hole 41a into which the insertion shaft 44a is detachably inserted. A stopper 44b and a protruding stripe 44c are formed in the plane electrode 44. A recessed stripe 41c is formed in the fixing hole 41a of the fixing arm 41.
申请公布号 JP2001135670(A) 申请公布日期 2001.05.18
申请号 JP19990314389 申请日期 1999.11.04
申请人 SONY CORP 发明人 ICHIMURA HIROYUKI
分类号 H01L21/60 主分类号 H01L21/60
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