| 摘要 |
PROBLEM TO BE SOLVED: To providing a coating device of bonding paste that has improved operability and can obtain improved coating quality, and to provide its coating method. SOLUTION: In the coating method of bonding paste for drawing and coating the bonding paste by moving a coating nozzle at the chip-mounting position of a substrate, a drawing pattern setting table 53 for indicating the correspondence section between a drawing pattern used for controlling each of X, Y, and Z axes for moving the coating nozzle and a target chip size is stored at a storage part 46 in advance, a drawing pattern is selected from a drawing pattern section part 54 according to the chip size when the chip size is specified, and the speed pattern of each of the X, Y, and Z axes is calculated by a speed pattern calculation part 55 based on the selected drawing pattern, thus eliminating the need for setting the drawing pattern at each time and performing appropriate paste coating with improved coating quality constantly with improved operability.
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