Warped semiconductor device and method of manufacturing the same

摘要

A semiconductor device (1) includes a semiconductor chip (2) sealed inside a package (8). The chip is pressed and secured via a silver paste (4) onto a distortion die-pad (3) and connected via pads (5) and gold wire bonds (6) to lead wires (7) coupling the chip to external circuits. The chip has a sensor section, a large scale integration (LSI) section and a transistor section, the latter being placed in a distorted state part (31), such as warped, allowing normal operation. An independent claim is also included for a method of manufacturing a warped semiconductor device so that an element is held by the package in a predetermined state maintained only whilst the element is packaged and which is necessary for normal operation of the element.