发明名称 Heat sink for electronic parts and manufacture thereof
摘要 Heat dissipation fins 12 provided on a metal flat plate 10 with a predetermined distance and a metal base plate provided with a plurality of bottom-expanded recesses 15 on the flat surface 14 with a predetermined distance are prepared and pressing portions corresponding to the bottom-expanded recesses on the flat plate between fins to press down protrusions provided on the back side of the flat plate into the bottom-expanded recesses to fix the heat dissipation fins and the base plate securely. Number of components of the heat sink is reduced and construction has become simple. The manufacturing cost is reduced.
申请公布号 GB0107406(D0) 申请公布日期 2001.05.16
申请号 GB20010007406 申请日期 2001.03.23
申请人 MIZUTANI ELECTRIC IND CO LTD 发明人
分类号 H01L23/36;H01L21/48 主分类号 H01L23/36
代理机构 代理人
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