发明名称 LASER BEAM MACHINING EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To solve such a problem that micro cracks arise in the glass material due to concentration of stresses and a edge side of a glass plate is weakened by such a processing method that a grinder is used in processing a edge side of a glass plate, namely that the ridge of the side face is processed through ground and rounded by a grinder up to now. SOLUTION: In the solution, the laser processing equipment A1 provides a carrying equipment 10, lens-units 20a and 20b, a moving equipment 30 of lens-units and a irradiating equipment 40 of laser beams. And when the moving equipment 30 of lens-units moves the lens-units 20a and 20b, and when the carrying equipment 10 carries the work 80, at the same time the irradiating spots of laser beams move on the work 80 along the front edge side 81 or behind edge side 84 of the work 80.</p>
申请公布号 JP2001129680(A) 申请公布日期 2001.05.15
申请号 JP19990308981 申请日期 1999.10.29
申请人 SHIN MEIWA IND CO LTD 发明人 OKAMOTO KOICHI;YAMAKAWA KENJI;IWASAKI YASUKUNI
分类号 B23K26/08;B23K26/00;B23K26/40;(IPC1-7):B23K26/08 主分类号 B23K26/08
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