| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting solder balls on a board while correcting warpage. SOLUTION: Warpage of a board is corrected by pressing a head having a lower surface, provided with a plurality of protrusions and suction holes, against a board. After the board is held flatly by means of a vacuum chuck pad provided on a board mounting base, solder balls are separated from the suction holes and mounted on the board.
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