| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device mounting a thin semiconductor element in which a chip is not cracked easily at the time of handling and a joint or the semiconductor element is protected against damage due to a stress being generated through bonding of an electrode part when the chip is mounted on a board. SOLUTION: A plurality of chips 1 are mounted on a board 2 (step S1), the joint of the board 2 and the chip 1 is sealed (step S2) and then the rear surface of the chips 1 is polished collectively (step S3) before the chips 1 are segmented. |
