FLAME-RETARDED ADHESIVE, METHOD OF PRODUCING THE SAME, FLAME-RETARDED ADHESIVE MEMBER, CIRCUIT BOARD HAVING FLAME-RETARDED ADHESIVE MEMBER FOR INSTALLING IN SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a flame-retarded adhesive, a flame-retarded adhesive member and the like having heat resistance and moisture resistance required when mounting a semiconductor chip having much different coefficient of thermal expansion from that of a circuit board for installing in a semiconductor thereon and having flame retardancy. SOLUTION: This flame-retarded adhesive comprises (1) 100 pts.wt. of the total of an epoxy resin and an curing agent thereof in which at least either of them is halogenated, (2) 50-300 pts.wt. of an epoxy group-containing acrylic copolymer containing 2-6 wt.% of glycidyl (meth)acrylate and having >=-10 deg.C Tg (glass transition temperature) and >=800,000 weight-average molecular weight and (3) 5-30 pts.wt. of a flame retardant auxiliary and the flame-retarded adhesive member, etc., uses the flame-retarded adhesive.