| 摘要 |
A substrate treating apparatus for subjecting a substrate to a treatment including a heating or cooling treatment has a plate for heating or cooling the substrate. The plate has a plurality of holes formed therein and is arranged to be positioned under the substrate. A plurality of lifter pins for moving the substrate up and down are inserted in the holes, respectively, formed in the plate, and are incorporated with the plate to be movable up and down. A plurality of springs are arranged to bias the lifter pins downward, respectively. A push-up mechanism is used for pushing up the lifter pins while being in contact with bottom ends of the lifter pins. The push-up mechanism is arranged to be separable from the lifter pins. A driving mechanism is arranged to drive the push-up mechanism.
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