发明名称 |
Method for compression molding |
摘要 |
A compression molding method reduces or removes adhesion property between a mold substrate and a high polymer material, which is to be imprinted with a pattern from the mold substrate. Accordingly, a pattern having increased granularity to tens of A can be obtained for application to fabrication processes of semiconductor devices and electronic products. The compression molding method can use a patterned mold and preferably a high polymer material to be imprinted with the pattern. The method can further include heating one of the mold and the high polymer material, compression-molding the mold and the high polymer material, cooling the heated one for a prescribed time and separating the high polymer material and the mold from each other.
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申请公布号 |
US6228294(B1) |
申请公布日期 |
2001.05.08 |
申请号 |
US19990304049 |
申请日期 |
1999.05.04 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
LEE HONG HEE;KANG DAL YOUNG |
分类号 |
B29C43/00;B29C33/60;B29C37/00;B29C43/02;B29C43/36;(IPC1-7):B05D5/08;B29C33/58 |
主分类号 |
B29C43/00 |
代理机构 |
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代理人 |
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主权项 |
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