| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for eliminating a sealing defect (air bubble, etc.), caused by a pressure-difference short which occurs in vacuum pressure- difference printing method. SOLUTION: A semiconductor element is mounted on a substrate comprising a wiring, and the semiconductor element is connected to the wiring part of substrate with a conductive metal. Then, the semiconductor element and connection part as well as its vicinity are sealed with a liquid resin sealing material. Here, a liquid resin sealing material containing a solvent by 5-50 wt.% is used for sealing by a vacuum pressure-difference printing method. |
