发明名称 TRANSFER CONVEYOR IN SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To transfer a printed wiring board, while keeping it accurately at a prescribed height, in a transfer conveyor of a soldering device which solders the printed wiring board, while passing it above a jet stream of a melted solder. SOLUTION: A holding claw 1 provided on a transfer chain 3 of a transfer conveyor is provided with a reference plane 1a of a holding claw, of which the vertical positional dimension is regulated for the plate surface of a printed wiring board 102 and a rod 2 provided vertically movable to the transfer chain 3, and a reference plate 11 is provided adjustable at the vertical position to a conveyor frame 12 of the upper part of a solder bath, as well as being at angle in the pitching direction P. The reference plane 1a of the holding claw is slided and guided along and in contact with a reference plane 11a of a reference plate, and the printed wiring board 102 is immersed in a jet stream at precise depth.
申请公布号 JP2001119135(A) 申请公布日期 2001.04.27
申请号 JP19990300336 申请日期 1999.10.22
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 TOBA HIDEAKI
分类号 B23K1/00;B23K1/08;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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