| 发明名称 |
Photosensitive resin and photosensitive resin composition containing the same |
| 摘要 |
The present invention relates to a novel photosensitive resin which can be developed in water and which can be used as a photosensitive resin composition. More specifically, the present invention relates to a composition which is useful as a photosensitive soldering resist for printed circuit board.
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| 申请公布号 |
US6221972(B1) |
申请公布日期 |
2001.04.24 |
| 申请号 |
US19970927086 |
申请日期 |
1997.09.10 |
| 申请人 |
AJINOMOTO CO., INC. |
发明人 |
NAKAMURA SHIGEO;YOKOTA TADAHIKO |
| 分类号 |
C08G59/14;C09D163/10;G03F7/029;G03F7/038;(IPC1-7):C08F8/30;C08F8/34 |
主分类号 |
C08G59/14 |
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