发明名称 SOLDER ABSORBER
摘要 PROBLEM TO BE SOLVED: To provide a solder absorber improving the convenience by absorbing the solder sucked in a filter with the solder absorber disposed in the filter to restrain the occurring frequency of clogging in the filter. SOLUTION: The solder sucked in a main body enters into the filter 4 through a sucking path 5 from a sucking hole 2a. In the filter 4, solder absorbing wires weaving copper wires to the mesh state are disposed as the solder absorbing body 10, and the solder entering in the filter 4 is hit to the solder absorbing body 10 and absorbed. In this way, the solder amount stuck to the opening part 4b of the filter 4 can be reduced and the occurring frequency of the clogging in the filter 4 is restrained and the convenience can be improved.
申请公布号 JP2001113362(A) 申请公布日期 2001.04.24
申请号 JP19990294781 申请日期 1999.10.18
申请人 MURATA MFG CO LTD 发明人 SHIMADA MISUZU
分类号 B23K1/018;B23K3/02;(IPC1-7):B23K1/018 主分类号 B23K1/018
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