发明名称 PRINTED BOARD HEATING METHOD AND HEATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent temperature unevenness in the heating apparatus of a printed board and the temperature rise of the printed board after the heaters of the heating apparatus are turned off, by a method wherein a suction part with an opening/closing valve is provided on the heating apparatus and the air in the apparatus is sucked by the suction part. SOLUTION: A suction part 20 is provided on the heating apparatus 1 of a printed board. The hot air in the apparatus 1 is sucked out by the suction part 20 to prevent temperature unevenness inside the apparatus 1 and respective printed boards 9, and the temperature rise inside the heating apparatus 1 after the heaters 11 of the apparatus 1 are turned off.
申请公布号 JP2001111196(A) 申请公布日期 2001.04.20
申请号 JP19990282856 申请日期 1999.10.04
申请人 JAPAN STEEL WORKS LTD:THE 发明人 TOMOTSUGI HEIJI;NAGAKURA HIROMASA
分类号 H05K3/00;C21D1/40;F27B9/30;F27D11/02;(IPC1-7):H05K3/00 主分类号 H05K3/00
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