| 摘要 |
PROBLEM TO BE SOLVED: To ensure high mounting reliability to mount electronic components, even when a nonlead solder or a thin and flexible mounting board is used. SOLUTION: This mounting method comprises housing electronic components 3 in an electronic component housing 1bd, setting a mounting board 2 on the topside of an air cap 1b, evacuation holes 1ba, 1bb, 1bc through vacuum pipes 1ca, 1cb, 1cc for vacuum chucking the electronic components 3 and the mounting board 2, thus temporally securing the electronic components 3 and the mounting board 2. After securing the electronic components 3 and the mounting board 2, the backside of the mounting board 3 opposite to its mounting side is heated locally for mounting the electronic components 3, using an electric heater- containing iron 1a, until solder paste melts to solder the electronic components 3 to the mounting board 2.
|
