SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having an improved sufficient heat-resistance even to a soldering process and a method for manufacturing the semiconductor device. SOLUTION: A semiconductor element is sealed with a thermoplastic resin whose glass transition temperature is 120 deg.C or higher, and full light transmittance is 90% or more for the thickness of 3 mm, and the surface of the sealing resin is coated with ultraviolet curing resin.