发明名称 COMPOSITION CONTAINING CURABLE OLIGOMER
摘要 PROBLEM TO BE SOLVED: To obtain a polyphenylene oligomer, which is a polymer derivative in ultrasmall electronic processing, and to provide a use thereof and products produced therefrom. SOLUTION: This composition comprises a specific solvent (preferably a mixture ofγ-butyrolactone and mesitylene) and a curable oligomer contained therein and prepared by reacting a biscyclopentadienone compound, a polyfunctional acetylene compound, and if necessary, a diacetylene compound. Integrated circuit products produced by using the composition and a method for producing the same are also provided. Since having a high thermal stability, a high glass transition temperature, a low permittivity, and a capability for filling gaps and for flattening a patterned surface, the composition is useful as an interlayer dielectric in integrated circuits.
申请公布号 JP2001106880(A) 申请公布日期 2001.04.17
申请号 JP19990272739 申请日期 1999.09.27
申请人 DOW CHEM CO:THE 发明人 JAMES P GODDOSHARUKUSU;BRIAN B MARTIN;ROBERT A DEVRIES;MICHAEL G SURUMONZU;RINNE K MILLS;TODD A PIKKARINGU
分类号 C08L65/00;C08G61/10;C08K5/01;C08K5/07;C08K5/1535;C08K5/3415;C09D165/02;H01L21/768;H01L23/14;H01L23/522;(IPC1-7):C08L65/00 主分类号 C08L65/00
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