| 摘要 |
An advanced zero-insertion force (ZIF) socket for coupling an electronic package having a plurality of electrical pins and a heat sink having a heat sink alignment and retention means onto a printed circuit board (PCB) of a computer system. Such a ZIF socket comprises a base having a plurality of receptacles adapted to receive electrical pins of an electronic package; a top plate slidably mounted on the base, having a plurality of pin insertion apertures adapted to permit insertion of the electrical pins of the electronic package; and a cam mechanism which is operable for sliding the top plate over the base in a first direction to permit insertion of the electrical pins of the electronic package into respective apertures of the base, and for sliding the top plate over the base in a second direction opposite to the first direction to secure an electrical coupling of the electrical pins of the electronic package with the receptacles of the base while simultaneously securing the heat sink in place on top of the electronic package and the base, via the heat sink retention means.
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