| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting unit which ensures a high heat-dissipating property, which miniaturizes a board size, which simplifies a production process and which increases the operating reliability of a mounted circuit. SOLUTION: A power circuit component 13 as a bare chip is mounted on a lead frame 23 at a connector 11 which is molded integrally with a case 16. Thereby, a special heat sink or the like for heat dissipating is not required at the power circuit component 13, the power circuit component 13 does not occupy a large area on a board 12, and the board 12 itself can be miniaturized. In addition, since the connector 11 is molded integrally with the case 16, it is not required to perform an operation in which the lead terminal of a connector is passed through a through hole in a board so as to be soldered when the board is made to flow in a solder thank as in conventional cases, the connector 11 can be attached very simply, and an interlead pitch is not required so much in the connector 11, and a dead space is not generated on the board 12. |
