INTEGRATED CIRCUIT CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a structure and a process for incorporating air or another gas in a multi-layer chip as a permanent dielectric medium by supplying a CVD diamond as dielectrics in semi-sacrificial layer and in-layer dielectrics. SOLUTION: A CVD diamond is supplied as dielectrics in semi-sacrificial layer and in-layer dielectrics, and then a semi-sacrificial dielectrics is at least partially removed by isotropic oxygen etching. A disclosed one deformed example presents a eventual permanent CVD diamond sealing material for a gas dielectric medium to be confined in a chip.