| 摘要 |
A chip device and a manufacturing method therefor are disclosed, in which the resistivity of the chip resistor device is constantly maintained even without using silver for lowering the self resistance in portions other than the upper electrode, thereby curtailing the manufacturing cost of the chip resistor. The chip resistor device 1 includes a chip block 10 having an upper face 12 and a pair of mutually oppositely facing side faces 14. An electrode part 20 has an upper electrode 22 formed on the upper face 12 of the chip block 10, and a side electrode 24 formed on the side faces 14 of the chip block 10. A special electrical property layer 30 is connected to the upper electrode 22 of the chip block 10. A protecting layer 40 is formed upon the special electrical property layer 30 to protect it. A terminal electrode layer 50 is formed on the electrode part 20 of the chip block 10, and a terminal connection part S is necessarily provided to form a signal bypassing path. In this chip device, even without using silver in the electrodes other than the upper electrode, the resistance characteristics of the chip resistor device are maintained constantly, so as to make it possible to save the manufacturing cost.
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