发明名称 Hot dipping apparatus
摘要 <p>A heating furnace (2) heats a workpiece to be plated. An ingot preheating furnace (8) encloses an ingot carrying device (7) that carries ingots (6) to a place near a melting furnace (3) that melts the ingots (6) of a plating material, contains the molten plating material in which a workpiece to be plated is immersed. The ingot preheating furnace (8) preheats the ingots (6) supported by the ingot carrying device (7) at a temperature below the melting point of the ingots (6) by an exhaust gas (G) discharged from the heating furnace (2). &lt;IMAGE&gt;</p>
申请公布号 EP1091011(A2) 申请公布日期 2001.04.11
申请号 EP20000121705 申请日期 2000.10.04
申请人 KAWASAKI JUKOGYO KABUSHIKI KAISHA 发明人 OGINO, ISAO;AOKI, YUKIKAZU
分类号 C23C2/00;C23C2/02;C23C2/06;(IPC1-7):C23C2/00 主分类号 C23C2/00
代理机构 代理人
主权项
地址