发明名称 Giga-bit interface convertor bracket with enhanced grounding
摘要 A giga-bit interface convertor module bracket assembly having upper and lower ground springs. The upper ground spring has upper wing-shaped springs in the upper part of the front opening of the bracket assembly and a pair of upper spring tabs on the interior of the bracket assembly. The lower ground spring has lower wing-shaped springs in the lower part of the front opening of the bracket assembly and a pair of lower spring tabs on the interior of the bracket assembly. When a giga-bit interface convertor module is inserted in the bracket assembly through the front opening, the upper and lower spring tabs bias against the top and bottom walls of the giga-bit interface convertor module to provide grounding thereto. Additionally, the upper and lower wing-shaped springs contact with a front panel of an enclosure or bracket or an electronic card on which the bracket assembly sits. The lower ground spring is provided with a bottom ground spring to contact the electronic card for grounding.
申请公布号 US6215666(B1) 申请公布日期 2001.04.10
申请号 US19980168702 申请日期 1998.10.08
申请人 SUN MICROSYSTEMS, INC. 发明人 HILEMAN VINCE P.;O'SULLIVAN CORNELIUS B.
分类号 G06F1/18;G06F1/16;G11B33/12;(IPC1-7):H05K5/00 主分类号 G06F1/18
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