| 摘要 |
A method of molding BGA semiconductor packages comprises grounding a PCB in the package to a grounded mold during the process of molding the package, thus preventing an accumulation of electrostatic charge on the components of the BGA package, thereby preventing any damage to the semiconductor chips, bonding wires or conductive traces in the package resulting from a sudden discharge of such an accumulated charge. The means for grounding the PCB may include grounding projections on one of the molds, and/or may comprise grounding pads, grounding bosses, or grounding tooling holes in the PCB. The grounding projections on the mold are positioned on opposite sides of a runner in the mold. The grounding pads or bosses are electrically connected to a ground via hole and a ground trace, and, in one embodiment are positioned on the bottom surface of the PCB outside of a package separation line. The grounding tooling hole is internally plated with a conductive metal layer to receive and make an electrical contact with a conductive tooling pin extending from one of the molds.
|
