| 摘要 |
PROBLEM TO BE SOLVED: To align a reticle with a wafer with high accuracy by using a TTL- type alignment microscope, without being influenced by the position change of an optical magnification adjustment less. SOLUTION: A semiconductor exposure apparatus has a projection lens, throuth which the circuit pattern of a reticle is projected upon a wafer surface with contracted dimensions, a position measurement mechanism which measures the position of an alignment mark on the wafer via the projection lens, an optical magnification adjustment lens which is arranged between the reticle and the wafer on the optical axis of the projection lens and has very weak power, a drive mechanism which drives the optical magnification adjustment lens in the direction of the optical axis of the projection lens, and a lens position sensor which detects the position of the optical magnification adjustment lens. A calculation means which corrects the measured value of the position of the alignment mark according to the position of the optical magnification adjustment lens is utilized.
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