发明名称 COMPRESSION CONNECTION BOARD, LIQUID CRYSTAL DEVICE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain the compression connection structure of a compression connection board such as a double-sided wiring type compression connection board, a multilayer interconnection type compression connection board, etc., in which a plurality of wiring layers are layered and which has terminals in the same regions of both front and rear surfaces so as to overlap each other stably and with high connection reliability. SOLUTION: A compression connection board 3 which is connected to a compression connection object by compression has front side terminals 4 which are electrically connected to opposite side terminals and rear side terminals 8 formed on the rear side of the front side terminals 4. The rear side terminals are arranged with inclinations from the front side terminals. As uniform pressures are applied to the board side terminals when a compression is applied for compression treatment, a compression connection structure with a high connection reliability can be obtained.
申请公布号 JP2001094225(A) 申请公布日期 2001.04.06
申请号 JP20000100759 申请日期 2000.04.03
申请人 SEIKO EPSON CORP 发明人 UCHIYAMA KENJI
分类号 G02F1/1345;G09F9/00;H05K1/02;H05K1/11;H05K1/14;(IPC1-7):H05K1/14 主分类号 G02F1/1345
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