| 摘要 |
PURPOSE: A system for cooling a back side of a wafer using helium gas is provided to decrease a possibility of a defect caused by an unstable temperature of a process wafer, wherein the unstable temperature results from a change of pressure and temperature of the system. CONSTITUTION: A pipe at a supply part is composed of a valve and a unit pressure controller(17) which are installed in a path of the pipe. A pipe at an equipment part has a hole and a groove, connected to the supply part. The hole is formed in a lower electrode and an electrostatic chuck(13) of an etching chamber(10). The groove is connected to the hole, and contacts a back side of a wafer(11) to form a path of helium gas. A pipe at an exhaust pipe includes a switching valve, a needle valve for controlling pressure and an exhaust pump(23) in the pipe, branched at a location where the supply part and the equipment part are connected.
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