发明名称 METHOD FOR MANUFACTURING OF SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To reduce defects in an epitaxial silicon film formed at a low depositional temperature. SOLUTION: This method comprises a process for epitaxially growing a silicon film on one main face of a single-crystal silicon substrate and a process for carrying out heat treatment in an oxidizing atmosphere.
申请公布号 JP2001093900(A) 申请公布日期 2001.04.06
申请号 JP19990272325 申请日期 1999.09.27
申请人 TOSHIBA CORP 发明人 MIZUSHIMA ICHIRO;KANBAYASHI SHIGERU
分类号 H01L21/205;H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/205
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